EN 60749-21:2005
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Published date
02-15-2005
Withdrawn date
01-01-2008
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Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60749-21:2005 | Equivalent |
| BS EN 60749-21:2005 | Equivalent |
| UNE-EN 60749-21:2005 | Identical |
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