EN 61191-3:1998
Withdrawn
Withdrawn
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Published date
10-28-1998
Withdrawn date
07-01-2001
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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CEI EN 61191-3:2001-10 | Identical |
| UNE-EN 61191-3:1998 | Identical |
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