EN 62137-4:2014/AC:2015
Current
Current
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Amendment of
Published date
02-13-2015
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| DocumentType |
Corrigendum
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
Summarise
Sorry this product is not available in your region.