ENV 1292 : DRAFT 1995

1 Scope
2 Normative References
3 Definitions and abbreviations
3.1 definitions
3.1.1 core recommendations: The documents device under
        testing which the customer describes to the testing
        institution a precise set of tests and its suite
3.2 abbreviations
4 Test methods
4.1 ICC Electrical tests
4.1.1 I/O contact
4.1.2 Fall and rise times for I/O contact
4.1.3 VPP contact
4.1.4 CLK current
4.1.5 RST current
4.1.6 VCC current
4.2 IFD ELECTRICAL TESTS
4.2.1 Spurious voltage on outputs
4.2.2 Activation of contacts
4.2.3 VCC voltage
4.2.4 VPP contact
4.2.5 Input/Output contact
4.2.6 CLK contact
4.2.7 RST voltage
4.2.8 Card Reset
4.2.9 Deactivation of the contacts
4.2.10 Detection of card removal
4.3 ICC COMMUNICATION TESTS
4.3.1 Testing tool specifications
4.3.2 Answer to reset (ATR) timing
4.3.3 Character repetition
4.3.4 Parity error detection
4.3.5 Structure and content of ATR
4.3.6 Global characters
4.3.7 Interface characters (TAi, TBi, TCi, TDi)
4.3.9 Block Guardtime (BGT)
4.3.10 Block sequencing by the card
4.3.11 Reactions of the ICC to protocol errors
4.3.12 Recovery of a transmission error by the ICC
4.3.13 Resynchronisation
4.3.14 IFSD negotiation
4.3.15 Abortion by the IFD
4.4 IFD PHYSICAL TESTS
4.4.1 IFD location of the contacts
4.4.2 Insertion/withdrawing forces
4.4.3 Pushing force on the ICC contacts
4.4.4 Physical damage
4.4.5 Heat dissipation
4.5 IFD COMMUNICATION TESTS
4.5.1 Character repetition
4.5.2 Character frame
4.5.3 Structure of a command header for T=0 protocol
4.5.4 VPP request for T=0
4.5.5 Character Waiting Time (CWT)
4.5.6 Block Guardtime (BGT)
4.5.7 Block sequencing by the IFD
4.5.8 Reactions of the IFD to invalid PCBs
4.5.9 Recovery of a transmission error by the IFD
4.5.10 IFSC negotiation
4.5.11 Abortion by the ICC
4.5.12 Recovery of an error in a S(RESYNCH response) block