I.S. EN 62258-1:2010
Current
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
Hardcopy , PDF
English
01-01-2010
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 62258-1:2010 | Identical |
| EN 62258-1:2010 | Identical |
| NF EN 62258-1 : 2011 | Identical |
| IEC 62258-1:2009 | Identical |
| NBN EN 62258-1 : 2010 | Identical |
| DIN EN 62258-1:2011-04 | Identical |
| UNE-EN 62258-1:2010 | Equivalent |
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