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IEC 60191-2S:1995

Withdrawn

Withdrawn

View Superseded by

Seventeenth supplement

Available format(s)

Hardcopy , PDF

Language(s)

English - French

Published date

10-11-1995

Withdrawn date

06-26-2024

Superseded by

IEC 60191-2:2012 DB

US$14.00
Excluding Tax where applicable

Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommdended Values for Certain Dimensions of Drawings of
Semiconductor Devices
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations Between Case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2
Deletions to the Lists of National Sheets of IEC Publication 60191-2

Incorporated into main document IEC 60191 PT2.

Committee
TC 47/SC 47D
DevelopmentNote
This standard is part of the Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately.
DocumentType
Standard
Pages
7
PublisherName
International Electrotechnical Committee
Status
Withdrawn
SupersededBy

Standards Relationship
NEN 10191-2 : 1997 Identical

IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

US$14.00
Excluding Tax where applicable