IEC 60191-3A:1976
Superseded
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
Hardcopy , PDF
English - French, Russian
01-01-1976
09-12-2022
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
| Committee |
TC 47/SC 47D
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| Standards | Relationship |
| BS 3934:Addendum No. 6:1989 | Similar to |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| BS 3934:1965 | Similar to |
| CEI 47-7 : 1ED 1981 | Identical |
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