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IEC 60249-2-11:1987

Withdrawn

Withdrawn

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Available format(s)

Hardcopy , PDF

Published date

05-15-1987

Withdrawn date

07-23-2013

US$57.00
Excluding Tax where applicable

FOREWORD
PREFACE
Clause
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
   after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing

Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). The sheet consists of an insulating base (epoxide resin bonded woven glass fabric laminate) with metal foil bonded to one or both sides.

Committee
TC 91
DevelopmentNote
Also numbered as BS EN 60249-2.11 (06/2001)
DocumentType
Standard
Pages
42
PublisherName
International Electrotechnical Committee
Status
Withdrawn

BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards

US$57.00
Excluding Tax where applicable