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IEC 60748-23-2:2002

Current

Current

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-23-2002

US$578.00
Excluding Tax where applicable
Summarise this standard

Applies to high quality approval systems for hybrid integrated circuits and film structures.The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave.These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturers' quality control and handling procedures.

Committee
TC 47/SC 47A
DevelopmentNote
To be read in conjunction with IEC 60748-23-1, IEC 60748-23-3 and IEC 60748-23-4. (05/2002) Supersedes IEC 60186B. (07/2004) Stability Date: 2021. (11/2017)
DocumentType
Standard
Pages
97
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
BS IEC 60748-23-2:2002 Identical
NEN IEC 60748-23-2 : 2002 Identical

US$578.00
Excluding Tax where applicable