IEC 60749-15:2003
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF
English - French
02-07-2003
09-12-2022
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 60749-15:2003 | Identical |
| BS EN 60749-15:2003 | Identical |
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