IEC 60749-19:2003
NA
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Hardcopy , PDF
02-13-2003
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
NA
|
| Standards | Relationship |
| UNE-EN 60749-19:2003 | Identical |
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