IEC 61076-5:2001

FOREWORD
1 Scope and object
2 General
  2.1 Normative references
  2.2 Marking
  2.3 Information to be given in a detail specification
  2.4 Standard values
  2.5 Classification
      2.5.1 Termination types
      2.5.2 Contact style
      2.5.3 Insulator body configuration
      2.5.4 Decoupling capacitor
3 Quality assessment procedures
  3.1 General
  3.2 Primary stage of manufacturing
  3.3 Structurally similar sockets
  3.4 Lot-by-lot inspection tests
  3.5 Periodic inspection tests
  3.6 Alternative test methods
4 Test methods and procedures
  4.1 General aspects
  4.2 Pre-conditioning
  4.3 Mounting of specimens
5 Supplementary test information
  5.1 Test conditions
  5.2 Mechanical tests
      5.2.1 Mating force for all socket sizes (insertion
             and withdrawal forces)
      5.2.2 Mechanical operation
      5.2.3 Contact retention
      5.2.4 Vibration
      5.2.5 Mechanical shock
      5.2.6 Terminal strength (robustness of terminations)
      5.2.7 Solder wicking (under consideration)
  5.3 Electrical tests
      5.3.1 Insulation resistance
      5.3.2 Voltage proof
      5.3.3 Contact resistance - Millivolt level method
      5.3.4 Capacitance
      5.3.5 Inductance (under consideration)
  5.4 Environmental tests
      5.4.1 Solderability
      5.4.2 Resistance to soldering heat
      5.4.3 Damp heat
      5.4.4 Dry heat
      5.4.5 Rapid change of temperature (thermal shock)
      5.4.6 Corrosive atmosphere or mixed flowing gas
             or harsh environment (gas tightness)
      5.4.7 Mould growth (fungus)
      5.4.8 Porosity (under consideration)
      5.4.9 Examination of dimensions and mass
      5.4.10 Visual examination
6 Packaging requirements
  6.1 Unit packing
7 Test schedule
  7.1 General
      7.1.1 Basic (minimum) test schedule
      7.1.2 Full test schedule
Annex A (informative) Terminology
Annex B (normative) Test method for determination of
        gas-tight characteristics for electrical
        connectors, sockets and/or contact systems

Defines functional levels, standard test methods and gauges for use in the examination of sockets designed for in-line electronic packages. Lays down appropriate reference dimensions of the mating device and board layout to establish intermateability and interchangeability criteria. Lays down test severity and performance requirements.