IEC 61189-1:1997
NA
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Hardcopy , PDF
English - French
03-27-1997
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
NA
|
| Standards | Relationship |
| UNE-EN 61189-1:1997 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.