IEC 61191-3:1998
Superseded
View Superseded by
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Hardcopy , PDF
English - French
08-28-1998
09-12-2022
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CEI EN 61191-3:2001-10 | Identical |
| UNE-EN 61191-3:1998 | Identical |
| JIS C 61191-3:2006 | Identical |
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