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IEC 61193-3:2013

Current

Current

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Available format(s)

Hardcopy , PDF

Language(s)

English - French

Published date

01-24-2013

US$542.00
Excluding Tax where applicable
Summarise this standard

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Sampling methodologies
5 Classification of attributes
6 Defects and process deviation indicator
   (PDI) evaluation
7 Inspection plans
8 Classification of defects
9 Percent defectives per million opportunities
10 Use of sampling plans
Annex A (informative) - Example of consensus sampling
        plan for three levels of conformance to requirements
        of IEC 62326-4 multilayer printed boards
Annex B (informative) - Example of consensus sampling plan
Annex C (informative) - Operating characteristics curves
        and values
Bibliography

IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.

Committee
TC 91
DevelopmentNote
Stability date: 2020. (09/2017)
DocumentType
Standard
Pages
136
PublisherName
International Electrotechnical Committee
Status
Current

US$542.00
Excluding Tax where applicable