IEC 61249-8-8:1997
Current
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Hardcopy , PDF
English - French
06-24-1997
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 61249-8.8 (11/2005) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249 8-8 : 1998 | Identical |
| NEN EN IEC 61249-8-8 : 1997 | Identical |
| I.S. EN 61249-8-8:1999 | Identical |
| PN EN 61249-8-8 : 2002 | Identical |
| EN 61249-8-8:1997 | Identical |
| DIN EN 61249-8-8:1998-01 | Identical |
| UNE-EN 61249-8-8:2000 | Identical |
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