IEC 61709:1996
Superseded
View Superseded by
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
Hardcopy , PDF
English - French, Spanish, Castilian
10-17-1996
12-31-2021
Gives guidance on the use of failure rate data for the reliabilityprediction of components in electronic equipment. Referenceconditions for failure rate data are specified, so that data fromdifferent sources can be compared. The reference conditions adoptedare typical of the majority of applications of components inequipment (e.g. telecommunication use, data processing). In thisstandard it is assumed that the failure rate used under referenceconditions is specific to the component i.e. it includes the effectof complexity, technology of the casing, dependence onmanufacturers and the manufacturing process, etc.
| DocumentType |
Standard
|
| Pages |
83
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS EN 61709:2000 | Identical |
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