IEC 62769-4:2021
Superseded
View Superseded by
Field Device Integration (FDI) - Part 4: FDI Packages
Hardcopy , PDF
English - French
02-05-2021
04-05-2023
IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
| Committee |
TC 65/SC 65E
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9311-9
|
| Pages |
165
|
| ProductNote |
THIS STANDARD ALSO REFERS TO ISO/IEC 29500-2:2016, FIPS 140-2
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| PN-EN IEC 62769-4:2021-11 | Identical |
| NF EN IEC 62769-4:2021 | Identical |
| NEN-EN-IEC 62769-4:2021 | Identical |
| BS EN IEC 62769-4:2021 | Equivalent |
| CEI EN IEC 62769-4:2021 | Identical |
| EN IEC 62769-4:2021 | Identical |
| I.S. EN IEC 62769-4:2021 | Identical |
| DS/EN IEC 62769-4:2021 | Identical |
| UNE-EN IEC 62769-4:2021 | Identical |
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