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IEC 62769-8:2023

Current

Current

Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping

Available format(s)

Hardcopy , PDF

Language(s)

English - French

Published date

04-05-2023

US$478.00
Excluding Tax where applicable

IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.

Committee
TC 65/SC 65E
DocumentType
Standard
Pages
105
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
DS/EN IEC 62769-8:2023 Identical
BS EN IEC 62769-8:2023 Equivalent
I.S. EN IEC 62769-8:2023 Equivalent
CEI EN IEC 62769-8:2023 Identical
UNE-EN IEC 62769-8:2023 Identical

CEI EN IEC 62769-109-1:2023 Field Device Integration (FDI®) Profiles - HART® and Wireless HART®

US$478.00
Excluding Tax where applicable