IEC 62878-1:2019
Current
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Hardcopy , PDF
English - French, English
10-14-2019
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7460-6
|
| Pages |
38
|
| ProductNote |
THIS STANDARD ALSO REFERS TO JPCA-EB01
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| CEI EN IEC 62878-1 : 2020 | Identical |
| EN IEC 62878-1:2019 | Identical |
| NEN-EN-IEC 62878-1:2019 | Identical |
| I.S. EN IEC 62878-1:2019 | Identical |
| NF EN IEC 62878-1:2019 | Identical |
| BS EN IEC 62878-1:2019 | Equivalent |
| UNE-EN IEC 62878-1:2019 | Identical |
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