IEC PAS 61249-3-1:2007
Withdrawn
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Hardcopy , PDF
English
05-30-2007
12-31-2021
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Designation of copper-clad laminates
4.1 Copper-clad laminate
4.2 Base materials
4.3 Thickness of the base material
4.4 Types of adhesives
4.5 Thickness of base materials and adhesives
4.6 Type of copper foil
4.7 Grade of copper foil
4.8 Copper-foil thickness
4.9 Types of profiles
4.10 Surface treatment to increase copper adhesivity
and anti-rust
4.11 Symbol for flammability
5 Observation
5.1 Base film
5.2 Copper foil
5.3 CCL
6 Size
6.1 Base film
6.1.1 Thickness and its allowance
6.2 Copper foil
6.2.1 Thickness and its allowance
6.3 Adhesives
6.3.1 Adhesives
6.4 Copper-clad laminates
6.4.1 Thickness and its allowance
6.4.2 Sheet dimension and its allowance
6.4.3 Role dimension and its allowance
7 Properties
7.1 Base film
7.2 Copper foil
7.3 CCL
8 Package and labelling
Annex A (normative) Roughness test
Annex B (normative) Dimensional stability test
Appendix - Additional information
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
| DevelopmentNote |
Stability Date: 2013. (10/2012)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DD IEC/PAS 61249-3-1:2007 | Identical |
| NEN NPR IEC/PAS 61249-3-1 : 2007 | Identical |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
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