IEC PAS 62173:2000

1 Purpose
2 Apparatus
  2.1 Solder pot
  2.2 Dipping device
  2.3 Optical equipment
  2.4 Steam aging equipment
  2.5 Lighting equipment
  2.6 Materials
  2.7 SMD reflow equipment
3 Procedure for simulated board mounting reflow
  solderability test in SMDs
  3.1 Test equipment set-up
  3.2 Specimen preparation and surface condition
  3.3 Visual inspection
4 Procedure for dip and look solderability testing
  4.1 Preconditioning
  4.2 Solder dip conditions
  4.3 Testing
5 Summary
Figures
Tables

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.