IEC PAS 62184:2000
Superseded
View Superseded by
Lead integrity test method
Hardcopy , PDF
English
08-22-2000
08-07-2003
FOREWORD
1 Purpose
2 Apparatus
3 General procedure applicable to all test conditions
4 General summary
5 Test condition A - Tension
6 Test condition B - Bending stress
7 Test condition C - Lead Fatigue
8 Test Condition D - Lead Torque
9 Test Condition E - Stud Torque
Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.
| DocumentType |
Miscellaneous Product
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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