IEC PAS 62307:2002
Superseded
View Superseded by
Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
Hardcopy , PDF
English
03-12-2002
07-24-2006
Foreword
1 Scope
2 Reference documents
3 Apparatus
4 Test sample
5 Procedure
6 Calculation of activation energy for moisture diffusion
7 Report results
Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
| DocumentType |
Miscellaneous Product
|
| Pages |
9
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 62307 : 2002 | Identical |
| ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
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