IEC PAS 62483:2006
Superseded
View Superseded by
Test method for measuring whisker growth on tin and tin alloy surface finishes
Hardcopy , PDF
English
09-12-2006
09-25-2013
FOREWORD
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus
5 Sample requirements and optional preconditioning
6 Whisker inspection, length measurement and test
conditions
Annex A - Process Flow for Sn-whisker Testing
Annex B - Validation of optical microscopy equipment
Annex C - Tin Whisker Images
Annex D - Non-Whisker Surface Formations
Annex E - Tin Whisker Test Standard Report Formats
Provides the methodology applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document
| DevelopmentNote |
Stability Date: 2012. (10/2012)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
27
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DD IEC/PAS 62483:2006 | Identical |
| NEN NPR IEC/PAS 62483 : 2006 | Identical |
| IPC 7530 : 0 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
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