IPC-2226A:2017
Current
Current
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Available format(s)
PDF
Language(s)
English, Japanese
Published date
09-01-2017
Publisher
Excluding Tax where applicable
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-324-6
|
| Pages |
48
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
Summarise