IPC-4101F:2026
Current
Current
Specification for Base Materials for Rigid and Multilayer Printed Boards
Available format(s)
PDF
Language(s)
English
Published date
06-01-2026
Publisher
Excluding Tax where applicable
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
| DocumentType |
Standard
|
| ISBN |
978-1-63816-249-0
|
| Pages |
168
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
Summarise