IPC-4554:2022
Withdrawn
Withdrawn
IPC-4555: Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Published date
04-01-2022
Publisher
Withdrawn date
09-14-2023
Sorry this product is not available in your region.
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits.
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Revision
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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Summarise
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