IPC 7092 : 2015
Superseded
Superseded
View Superseded by
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
Available format(s)
PDF
Language(s)
English
Published date
02-17-2015
Publisher
Superseded date
06-15-2023
Superseded by
Excluding Tax where applicable
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board.
| DocumentType |
Standard
|
| Pages |
137
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Summarise