IPC-7095D:2018
Superseded
Superseded
View Superseded by
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Amended by
Published date
02-22-2019
Publisher
Superseded date
01-25-2025
Superseded by
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This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages
| DocumentType |
Standard
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| ProductNote |
New Child AMD1 is Added
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
Summarise
Sorry this product is not available in your region.