IPC-7530:2025
Current
Current
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Available format(s)
PDF
Language(s)
English, Japanese
Published date
01-31-2025
Publisher
Excluding Tax where applicable
This document describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.
| DocumentType |
Standard
|
| ISBN |
978-1-63816-203-2
|
| Pages |
52
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
Summarise