IPC 9704 CHINESE : -
Withdrawn
Withdrawn
PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
Available format(s)
PDF
Language(s)
Chinese
Published date
02-01-2012
Publisher
Withdrawn date
09-14-2023
Excluding Tax where applicable
| DocumentType |
Standard
|
| ISBN |
978-1-61193-063-4
|
| Pages |
30
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 9703 : 0 | IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
| IPC 9708 : 0 | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9702 : 0 | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
| IPC 9707 : 0 | SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
Summarise