IPC A 21 : LATEST
Superseded
Superseded
View Superseded by
STANDARD PITCH STENCIL PATTERN FOR SLUMP
Published date
01-12-2013
Publisher
Superseded date
07-23-2013
Superseded by
Sorry this product is not available in your region.
Provided electronically, these Gerber files include patterns for developing solder paste stencils by laser or chemical etching. Land widths of 0.4 mm, 0.63 mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
Summarise
Sorry this product is not available in your region.