IPC A 24 : LATEST
Withdrawn
Withdrawn
SURFACE INSULATION RESISTANCE
Published date
11-23-2012
Publisher
Withdrawn date
09-13-2023
Sorry this product is not available in your region.
A single sided (4 up) pattern for use in evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also provided. (2 pcs 30 x 45 cm 1:1). Also available electronically in Gerber. If ordering Gerber please specify electronic format IPC-A-24.
| DevelopmentNote |
Available only in Gerber format. (06/2008)
|
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC 9203 : 0 | USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
| IPC 9202 : 0 | MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
| IPC AC 62 : A | AQUEOUS POST SOLDER CLEANING HANDBOOK |
| IPC SC 60 : A | POST SOLDER SOLVENT CLEANING HANDBOOK |
| IPC-9202A:2022 | Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly |
| IPC TP 1043 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 1 |
| IPC TP 1044 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 2 |
| IPC TP 1043 : 1992 | CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 1 |
| IPC TR 580 : 1989 | CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS |
Summarise
Sorry this product is not available in your region.