IPC DD 135 : 0
Withdrawn
QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
English
07-23-2013
1 SCOPE
1.1 Scope
1.2 Purpose
1.3 Classes
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 ASTM
3 PREPARATION FOR SPECIMENS FOR TEST
3.1 Scope
3.2 Specimen Configuration
3.3 Precautions
3.4 Apparatus
3.5 Procedure
3.6 Reporting of Specimen Processing History
4 MATERIAL PROPERTY TESTING AND REPORTING
4.1 Notes
4.2 Methods of Examination and Test
4.3 Property Reporting
5 REFERENCES
Gives information about the deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
| DevelopmentNote |
Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
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