IPC DRM SMT : F2015
Superseded
View Superseded by
SURFACE MOUNT SOLDER JOINT EVALUATION TRAINING & REFERENCE GUIDE
04-14-2015
04-27-2026
- Introduction
- Acceptance Criteria
- Classification
- Terminology
Chip Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
J-Lead Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
Gull Wing Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
- Area Array Components
- BALL GRID ARRAYS (BGA)
- Bottom Termination Components (BTC)
Exemplifies critical acceptance criteria for the evaluation of surface mount solder connections.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC DVD SMT : LATEST | SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
| IPC EDU 102 : LATEST | SURFACE MOUNT ASSEMBLY - TRAINING COURSE |
| IPC DRM 40 : E2002 | THROUGH HOLE SOLDER JOINT EVALUATION DESK REFERENCE MANUAL |