IPC DVD 68C : LATEST
Withdrawn
Withdrawn
LEAD FREE SURFACE MOUNT ASSEMBLY WITH TRAINING CERTIFICATION
Published date
11-23-2012
Publisher
Withdrawn date
09-12-2023
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Describes how the conversion to lead free production affects the surface mount assembly process - including solder paste application, verification of lead free components and circuit boards, special precautions for moisture sensitive devices, and the effects of higher soldering temperatures on reflow/wave soldering operations and requirements for post solder cleaning.
| DevelopmentNote |
Available in DVD format. (08/2006)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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Summarise
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