IPC EMTF 07T : 2007
Withdrawn
Withdrawn
TECHNOLOGY TRENDS FOR PRINTED CIRCUIT BOARDS FOR THE YEAR 2006
Published date
11-23-2012
Publisher
Withdrawn date
05-25-2016
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Presents data and analysis on trends in rigid PCB conductor width and spacing, metallic finishes, solder mask usage, multilayer production, laminate thickness and temperature, surface mounting, fine-pitch technology, and other leading-edge technologies. Survey sample consists of 16 companies representing different regions of the world.
| DevelopmentNote |
Supersedes IPC TMRC01T, IPC TMRC03T & IPC TMRC04T. (09/2008)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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| Supersedes |
Summarise
Sorry this product is not available in your region.