IPC FLXCSP0706-CD : 2006
Withdrawn
Withdrawn
IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
Published date
11-23-2012
Publisher
Withdrawn date
09-14-2023
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Describes circuitry and chip scale packaging (CSP) designs, materials and applications.
| DevelopmentNote |
Available in CD-ROM format. (09/2006) Supersedes IPC FLXCSP0605-CD. (08/2008)
|
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| Supersedes |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| IPC FLXCSP04-CD : 2004 | FLEX & CHIPS - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE AND BARE DIE |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 6013 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC FLXCSP0605-CD : 2005 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
| IPC FLXCSP03 : 2003 | "FLEX AND CHIPS" - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIPS SCALE PACKAGING - HARD COPY & CD-ROM |
Summarise
Sorry this product is not available in your region.