IPC FLXCSP0706-CD : 2006

Name: IPC FLXCSP0706-CD : 2006
Brand: IPC

Withdrawn

IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING

Withdrawn date

09-14-2023

Published date

11-23-2012

Publisher

Institute of Printed Circuits

Describes circuitry and chip scale packaging (CSP) designs, materials and applications.

DevelopmentNote	Available in CD-ROM format. (09/2006) Supersedes IPC FLXCSP0605-CD. (08/2008)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn
Supersedes	IPC FLXCSP0605-CD : 2005

IPC 4202 : A	FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
IPC 4203 : A	COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
IPC FLXCSP04-CD : 2004	FLEX & CHIPS - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE AND BARE DIE
IPC 4204 : A	FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 6013 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 2223 : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC FLXCSP0605-CD : 2005	IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
IPC FLXCSP03 : 2003	"FLEX AND CHIPS" - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIPS SCALE PACKAGING - HARD COPY & CD-ROM

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