IPC FLXCSP1104-CD : 2004
Superseded
Superseded
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IPC/TPCA INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
Published date
01-12-2013
Publisher
Superseded date
07-01-2005
Superseded by
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Addresses how a mix of flexible circuits and Chip Scale Packaging (CSP), are, in fact, the missing pieces to the interconnection puzzle.
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Standard
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IPC by Global Electronics Association
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Superseded
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Summarise
Sorry this product is not available in your region.