IPC HDI 1 : LATEST
Withdrawn
Withdrawn
HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
Published date
01-12-2013
Publisher
Withdrawn date
07-23-2013
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Compiles the standards, specifications and guidelines which a company needs to produce high density interconnect (HDI) and microvia boards.
| DevelopmentNote |
Includes IPC 2220, IPC 2315, IPC 4104, IPC 6016, IPC 6801, IPC CF 148 and IPC CF 152. (03/2002) Also available in CD-ROM format. (09/2003)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC CF 148 : A1998 | RESIN COATED METAL FOR PRINTED BOARDS |
| IPC 6016 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC CF 148 : A1998 | RESIN COATED METAL FOR PRINTED BOARDS |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IPC 6016 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
Summarise
Sorry this product is not available in your region.