IPC J STD 002 CHINESE : C
Withdrawn
Withdrawn
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
Publisher
Withdrawn date
09-13-2023
Sorry this product is not available in your region.
| DevelopmentNote |
Chinese translation of D2013 Edition is issued in July 2015. (05/2016) Also available in Hardcopy format. Jointly published by IPC, JEDEC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
Summarise
Sorry this product is not available in your region.