IPC-J-STD-003C:2013/AMD 1:2014
Superseded
Superseded
View Superseded by
Solderability Tests for Printed Boards
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
04-01-2014
Publisher
Superseded date
05-02-2026
Superseded by
Excluding Tax where applicable
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs).
| Committee |
5-20
|
| DocumentType |
Amendment
|
| Pages |
16
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
Summarise