IPC-J-STD-006B:2008
Superseded
Superseded
View Superseded by
Requirements for Electronic Grade Solder Alloysand Fluxed and Non-Fluxed Solid Solders for ElectronicSoldering Applications
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
10-01-2008
Publisher
Superseded date
05-02-2026
Superseded by
Excluding Tax where applicable
This standard prescribes the nomenclature,requirements and test methods for electronic grade solder
alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ‘‘special’’ electronic grade solders
| DocumentType |
Amendment
|
| Pages |
36
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
Summarise