IPC J STD 032 : 0
Withdrawn
Withdrawn
PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS
Available format(s)
PDF
Language(s)
English
Publisher
Withdrawn date
09-14-2023
Excluding Tax where applicable
1 SCOPE
1.1 Purpose
1.2 Intent
1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 General Performance Requirements
3.2 Classes of Ball Grid Array Joints
3.3 Mechanical Requirements
3.4 Electrical Parameters
3.5 Metallurgical/Chemical Requirements
4 CONSTRUCTION OF BGA BALLS
4.1 Physical Characteristics
Appendix A NORMATIVE TERMINOLOGY
Appendix B ACRONYMS
Defines the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.
| DevelopmentNote |
Jointly published by IPC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
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