IPC/JEDEC J-STD-033:1999
Superseded
Superseded
View Superseded by
Standard for Handling, Packing, Shipping andUse of Moisture/Reflow Sensitive Surface Mount Devices
Available format(s)
PDF
Language(s)
English
Published date
04-01-1999
Publisher
Superseded date
04-28-2026
Superseded by
Excluding Tax where applicable
Summarise this standard
AI-generated summary
This standard applies to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |