IPC JPCA 4104 : 0
Superseded
Superseded
View Superseded by
SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
Available format(s)
PDF
Language(s)
English
Publisher
Superseded date
05-01-1999
Superseded by
Excluding Tax where applicable
Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
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