IPC RF 245 : 1987
Withdrawn
Withdrawn
RIGID-FLEX PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
11-01-1998
Excluding Tax where applicable
NO CONTENTS SECTION
Establishes the qualification and performance requirements for rigid-flex printed boards. In the rigid-flex application, the conductor layers that are in the flexible portion of the rigid flex are also a layer in the rigid multilayer board.
| DocumentType |
Standard
|
| Pages |
78
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| IPC FC 241 : C1992 AMD 1 1995 | FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
Summarise