IPC S 804 : A1987
Superseded
Superseded
View Superseded by
PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR,
Published date
01-12-2013
Publisher
Superseded date
04-01-1992
Superseded by
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Provides a recommended test method which may be used by both vendor and user to determine solderability of printed wiring boards, with or without surface coatings, which will be soldered. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the printed wiring board. This is determined by evaluating the ability of those portions of the printed wiring board normally soldered to be wetted by the new cast of solder. Determination is judged by nondestructive methods.
| DevelopmentNote |
Supersedes IPC S 801 and IPC S 803. (04/2003)
|
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT) |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| IPC D 320A : 1981 | PRINTED BOARD, RIGID, SINGLE, AND DOUBLE-SIDED, END PRODUCT STANDARD |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| LLL-R-626 Revision D:1984 | ROSINS: GUM, WOOD, AND TALL OIL (S/S BY A-A-59142) |
| TT-I-735 Revision A:1963 | Isopropyl Alcohol |
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