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IPC TR 001 : 2006

Current

Current

The latest, up-to-date edition.

An Introduction to Tape Automated Bonding Fine Pitch Technology

Available format(s)

Hardcopy

Language(s)

English

Published date

01-01-2006

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules.

DocumentType
Technical Report
Pages
38
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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US$208.60
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